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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
Rev. 1 -- 19 April 2011 Product data sheet
1. Product profile
1.1 General description
Low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients. The device is housed in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
1.2 Features and benefits
ESD protection of one line Ultra small SMD plastic package Solderable side pads Package height typ. 0.37 mm Low diode capacitance Cd = 25 pF AEC-Q101 qualified ESD protection up to 26 kV IEC 61000-4-2; level 4 (ESD) IEC 61000-4-5 (surge); IPP = 3.5 A Low clamping voltage: VCL = 12 V
1.3 Applications
Computers and peripherals Audio and video equipment Communication systems Portable electronics
1.4 Quick reference data
Table 1. Symbol VRWM
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Quick reference data Parameter reverse standoff voltage diode capacitance f = 1 MHz; VR = 0 V Conditions Min Typ 25 Max 5 30 Unit V pF
Cd
NXP Semiconductors
PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Graphic symbol
1
2
1
2
006aaa152
Transparent top view
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name PESD5V0L1ULD Description leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm Version SOD882D Type number
4. Marking
Table 4. Marking codes Marking code[1] 1110 0000 Type number PESD5V0L1ULD
[1]
For SOD882D binary marking code description, see Figure 1.
4.1 Binary marking code description
CATHODE BAR
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READING DIRECTION VENDOR CODE
READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION
006aac477
Fig 1.
SOD882D binary marking code description
PESD5V0L1ULD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
2 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol PPP IPP Tj Tamb Tstg
[1] [2]
Parameter peak pulse power peak pulse current junction temperature ambient temperature storage temperature
Conditions tp = 8/20 s tp = 8/20 s
[1][2] [1][2]
Min -55 -65
Max 42 3.5 150 +150 +150
Unit W A C C C
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. Measured from pin 1 to 2.
Table 6. ESD maximum ratings Tamb = 25 C unless otherwise specified. Symbol VESD Parameter electrostatic discharge voltage Conditions IEC 61000-4-2 (contact discharge) machine model MIL-STD-883 (human body model)
[1] [2] Device stressed with ten non-repetitive ESD pulses. Measured from pin 1 to 2.
[2] [1][2]
Min -
Max 26 400 10
Unit kV V kV
Table 7. Standard
ESD standards compliance Conditions > 15 kV (air); > 8 kV (contact) > 4 kV
IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model)
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PESD5V0L1ULD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
3 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
001aaa631
120 IPP (%) 80 100 % IPP; 8 s
001aaa630
IPP 100 % 90 %
e-t 50 % IPP; 20 s
40
10 % tr = 0.7 ns to 1 ns 0 10 20 30 t (s) 40 30 ns 60 ns t
0
Fig 2.
8/20 s pulse waveform according to IEC 61000-4-5
Fig 3.
ESD pulse waveform according to IEC 61000-4-2
6. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter VRWM IRM VBR Cd VCL
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Conditions
Min 6.4 [1][2]
Typ 10 6.8 25 0.7
Max 5 100 7.2 30 9 12 -
Unit V nA V pF V V
reverse standoff voltage reverse leakage current VRWM = 5 V breakdown voltage diode capacitance clamping voltage IPP = 1 A IPP = 3.5 A IR = 5 mA f = 1 MHz; VR = 0 V
[3]
rdyn
[1] [2] [3]
dynamic resistance
IR = 10 A
-
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. Measured from pin 1 to 2. Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse; ANS/IESD STM5-1-2008.
PESD5V0L1ULD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
4 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
35 Cd (pF) 30
006aab565
10
006aac525
IRM IRM(25 C)
25 1 20
15
10 0 1 2 3 4 VR (V) 5
10-1 -75
-25
25
75
125 Tj (C)
175
f = 1 MHz; Tamb = 25 C
Fig 4.
Diode capacitance as a function of reverse voltage; typical values
Fig 5.
Relative variation of reverse leakage current as a function of junction temperature; typical values
I
-VCL -VBR -VRWM -IRM -IR - P-N
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V
+
-IPP
006aaa407
Fig 6.
V-I characteristics for a unidirectional ESD protection diode
PESD5V0L1ULD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
5 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
ESD TESTER RZ CZ DUT (Device Under Test)
450
RG 223/U 50 coax
4 GHz DIGITAL OSCILLOSCOPE 10x ATTENUATOR
50
IEC 61000-4-2 network CZ = 150 pF; RZ = 330
vertical scale = 10 A/div horizontal scale = 15 ns/div
vertical scale = 6 V/div horizontal scale = 100 ns/div
GND GND
unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)
clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network)
vertical scale = 10 A/div horizontal scale = 15 ns/div GND GND
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vertical scale = 6 V/div horizontal scale = 100 ns/div unclamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped -8 kV ESD voltage waveform (IEC 61000-4-2 network)
006aab566
Fig 7.
ESD clamping test setup and waveforms
PESD5V0L1ULD
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(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
6 of 12
NXP Semiconductors
PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
7. Application information
The PESD5V0L1ULD is designed for the protection of one unidirectional data or signal line from the damage caused by ESD and surge pulses. The device may be used on lines where the signal polarities are either positive or negative with respect to ground.
line to be protected (positive signal polarity)
line to be protected (negative signal polarity)
PESD5V0L1ULD
PESD5V0L1ULD
ground
ground
unidirectional protection of one line
006aac526
Fig 8.
Application diagram
Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESD5V0L1ULD as close to the input terminal or connector as possible. 2. The path length between the PESD5V0L1ULD and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point.
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8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
PESD5V0L1ULD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
7 of 12
NXP Semiconductors
PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
9. Package outline
0.65 0.55 0.30 0.22 2
0.4 max
0.65 0.30 0.22 1
1.05 0.95
0.55 0.45 Dimensions in mm
cathode marking on top side 10-08-06
Fig 9.
Package outline SOD882D
10. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PESD5V0L1ULD
[1]
Package SOD882D
Description 2 mm pitch, 8 mm tape and reel
Packing quantity 10000 -315
For further information and the availability of packing methods, see Section 14.
11. Soldering
1.4 0.2
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solder lands 0.8 (2x) 0.6 (2x) 0.7 (2x) solder resist solder paste Dimensions in mm 0.3 0.4 1 1.3
sod882d_fr
Reflow soldering is the only recommended soldering method.
Fig 10. Reflow soldering footprint SOD882D
PESD5V0L1ULD All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
8 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
12. Revision history
Table 10. Revision history Release date 20110419 Data sheet status Product data sheet Change notice Supersedes Document ID PESD5V0L1ULD v.1
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PESD5V0L1ULD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
9 of 12
NXP Semiconductors
PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2011. All rights reserved.
13.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any www..net representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
PESD5V0L1ULD
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Product data sheet
Rev. 1 -- 19 April 2011
10 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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PESD5V0L1ULD
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 -- 19 April 2011
11 of 12
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PESD5V0L1ULD
Low capacitance unidirectional ESD protection diode
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Binary marking code description. . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 April 2011 Document identifier: PESD5V0L1ULD

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